Laser-based decapsulation is an alternative method to traditional acid decapsulation for removing the protective cover from a chip package to expose the integrated circuit inside. This process uses a laser to ablate or vaporize the material covering the chip. The laser used for decapsulation is typically a high-powered, pulsed laser, such as a Q-switched Nd:YAG […]
What’s the difference between plastic and ceramic chip packages? Ceramic and plastic are two common materials used for chip packages in the electronics industry. Here are some of the main differences between them: In summary, ceramic packages offer better thermal and electrical properties, but they are more expensive and larger than plastic packages. Plastic packages […]
What is the difference between wet and dry decapsulation? The main difference between wet and dry decapsulation is the method used to remove the outer layers of the microelectronic device. Wet decapsulation involves using a chemical solution or etchant to dissolve or remove the outer packaging material, such as a plastic or ceramic encapsulant, that […]
What is decapsulation in failure analysis? Decapsulation, or decap, is a failure analysis technique that involves removing the outermost layers of a microelectronic device to examine the internal structures and identify the cause of a failure. This technique is commonly used in the semiconductor industry to identify defects or malfunctions in integrated circuits or other […]
What is delayering in failure engineering, and why do you need to delayer parts? Delayering is a process in failure engineering that involves selectively removing layers from a semiconductor device to expose the underlying components and conductors. This process is typically done using various chemical etching and mechanical polishing techniques to carefully remove layers one-by-one. […]